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Nanchang land port "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train was opened. On the morning of December 12th, two trains loaded with "Made in Jiangxi" drove out of Nanchang land port in turn under the supervision of Ganjiang New District Customs, marking the official opening of the "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train from Nanchang land port to Xiamen Port, which greatly boosted the construction of modern logistics system in Jiangxi to a new level.India's NIFTY 50 index fell, with the latest drop of 0.1%.Citigroup slightly lowered South Korea's GDP growth forecast to 1.5% next year. It is expected that the Bank of Korea will cut interest rates next month. Citigroup released a report saying that considering the worse economic sentiment in South Korea this month, it slightly lowered its GDP forecast for this year and next year by 0.1 percentage point to 2.1% and 1.5% respectively. The bank slightly lowered Korea's GDP growth forecast for the last quarter of this year by 0.1 percentage point to rise by 0.3% quarterly, and raised its GDP growth forecast for the first quarter of next year by 0.1 percentage point to rise by 0.6% quarterly. Looking forward to the first quarter of next year, the bank expects South Korea to adopt a combination of expansionary policies, including the Bank of Korea's expected interest rate cut to 2.75% in mid-January, and the government's expected additional budget of 30 trillion won (equivalent to about 1.1% of GDP next year). It is expected that the Bank of Korea will cut interest rates by 25BP each in January, April, July and October next year, and the final interest rate is expected to be 2%.

Chief Economic Adviser of India: Continuing to support high-quality capital expenditure will be the driving force to maintain India's economic growth.Samsung Electronics will hold its 2025 strategy meeting next week. Yonhap News Agency quoted unnamed industry sources as saying that Samsung Electronics will hold its 2025 global strategy meeting next week. The electronic products business meeting is scheduled to be held on Tuesday and Wednesday, while the semiconductor department meeting will be held on Thursday. The main agenda items include the upcoming Galaxy S25 smartphone. Lee Jae-yong, the company's executive chairman, is not expected to attend these meetings.Citigroup: Pinduoduo, which operates retail platform Temu, is likely to continue to face short-term disadvantages. Maintain the neutral rating of ADR in Pinduoduo and set the target price of ADR in Pinduoduo at $125.00. Note: The latest ADR report in Pinduoduo is $103.42.

The daily limit of Sanyuan shares and Panda dairy products rose due to changes in the dairy sector, while Sanyuan shares and Panda dairy products rose due to changes in the dairy sector. The western animal husbandry industry rose by over 15%, followed by Ligao food, qiaqia food and Nanqiao food.According to the Japan News Agency, Japan's House of Representatives is expected to pass an additional budget for fiscal year 2024 on Thursday.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)